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Intense Pulsed Light for Next-Generation Soldering Technology
Energy efficiency is always a popular topic in engineering. Reducing power consumption in manufacturing not only reduces cost, but also reduces CO2 emission and other environmental impact. Soldering is one…
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Thesis Project: In-Chip Thermoelectric Cooling
For the past four years, my PhD research has been mostly about developing an advanced in-chip thermoelectric cooling (TEC) device. This has been a rollercoaster of a project with Texas…
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Dynamic Multi-Hotspot Cooling: A Machine Learning Approach
With the rapid evolution of heterogeneous architectures such as System-on-Chip (SoC), chiplets, CoWoS, and 3D ICs, managing on-chip hotspots has become a complex and pressing challenge. These hotspots are no…
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SMA Thermal Switch
This thermal switch project was one of the highlights of my master’s program, offering me invaluable experience in FEM modeling and hands-on experimentation. The aim was to create a passive…
Jiajian Luo (He/Him)
Incoming NVIDIA Intern, PhD in Electronic Thermal Management, Semiconductor Packaging & Process Engineering
University of California, Irvine