Shape Memory Alloy Thermal Actuator

Jiajian Luo (He/Him)

PhD in Mechanical Engineering | ex-NVIDIA intern | Electronic Packaging • Data Center Cooling • Machine Learning for Thermal Management

University of California, Irvine

Nov 1, 2024
Shape Memory Alloy Thermal Actuator

This thermal switch project was one of the highlights of my master’s program, offering me invaluable experience in FEM modeling and hands-on experimentation.

The aim was to create a passive thermal switch that toggles between ON and OFF states based on temperature. At high temperatures, it switches ON, and at low temperatures, it switches OFF. Such a device could be used in temperature control modules like a battery thermal management system (BTMS) in electric vehicles (EVs) or spacecraft.

The heart of this thermal switch was a shape-memory alloy (SMA) spring, which behaves uniquely based on temperature: below a certain temperature, the SMA spring is soft and pliable; above a certain temperature, it becomes rigid and strong.

Simulating the thermal switch in FEM software was no walk in the park. The challenges included:
Coupled thermal-structural modeling: The SMA material’s mechanical properties change with temperature, requiring precise phase-change behavior definitions.
Contact modeling: Defining thermal and mechanical contact between components was tricky. Even when the geometry looked visually connected, the FEM software couldn’t detect the contact without proper settings.

My proudest multi-physics simulation for this project: Bottom plate gets hot → phase change happens in SMA → top parts contact → top parts become thermally conductive

After many iterations, we developed a working transient simulation. The system was exposed to an ambient temperature increase from 30℃ to 80℃ within 2 seconds. As the temperature rose, the SMA spring became rigid, enabling contact between the middle and top plates. The simulation showed a switching ratio of 13.95, meaning the heat conductance in the ON state was nearly 14 times greater than in the OFF state.

We built an experimental setup to test the functionality of our 3D-printed prototype (thanks to my colleague, Jungyun Lim, for the 3D printing). From top to bottom, this setup consists of liquid cold plate, quartz (for heat flux calibration), thermal switch and hot plate. By controlling the heat flux with hot plate power, we managed to show OFF state (with small gap) and ON state (with gap closed).

We used IR camera to detect the vertical thermal pathway (shown below). By calculating the thermal conductance in both OFF and ON states, we measured the experimental switching ratio to be 1.406 — a number that was way below our expectations 13.95. Some factors attributed to such a low-than-expected number: poor 3D printing quality, rough metal surface and imperfect contact.

Despite the outcome, this project taught me a lot about the intricacies of thermal-structural design and experimentation. While my journey with the thermal switch ended as I moved on to more pressing PhD projects, it remains a valuable chapter in my academic story.

    
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