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![[PhD Dissertation] Development of In-Chip Thermoelectric Cooling](https://i0.wp.com/jiajianluo.me/wp-content/uploads/2024/11/Picture3.png?resize=702%2C690&ssl=1)
[PhD Dissertation] Development of In-Chip Thermoelectric Cooling
For the past four years, my PhD research has focused on developing an in-chip thermoelectric cooling (TEC) device—one that could address the rising thermal challenges inside modern semiconductor systems. This…
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CFD Automation for Data Center Cooling Control
When NVIDIA launched Omniverse, I didn’t just see fancy graphics. I saw the start of a parallel universe where engineers could play god — building entire data centers as digital…
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Advancing Soldering — Thermal Analysis of Intense Pulse Light
Energy efficiency is always a popular topic in engineering. Reducing power consumption in manufacturing not only reduces cost, but also reduces CO2 emission and other environmental impact. Soldering is one…
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AI-Driven Dynamic TEC Cooling for SoC Systems
With the rapid evolution of heterogeneous architectures such as System-on-Chip (SoC), chiplets, CoWoS, and 3D ICs, managing on-chip hotspots has become a complex and pressing challenge. These hotspots are no…
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Shape Memory Alloy Thermal Actuator
This thermal switch project was one of the highlights of my master’s program, offering me invaluable experience in FEM modeling and hands-on experimentation. The aim was to create a passive…
Jiajian Luo (He/Him)
PhD in Mechanical Engineering | ex-NVIDIA intern | Electronic Packaging • Data Center Cooling • Machine Learning for Thermal Management
University of California, Irvine